Texas Instruments Stereo Amplifier THS3001 User Manual

User’s Guide  
March 1999  
Mixed-Signal Products  
SLOU021A  
 
Preface  
Related Documentation From Texas Instruments  
THS3001 HIGH-SPEED CURRENT-FEEDBACK OPERATIONAL  
AMPLIFIER (literature number SLOS217) This is the data sheet  
for the THS3001 operational amplifier integrated circuit that is  
used in the THS3001 evaluation module.  
FCC Warning  
This equipment is intended for use in a laboratory test environment only. It  
generates, uses, and can radiate radio frequency energy and has not been  
tested for compliance with the limits of computing devices pursuant to subpart  
J of part 15 of FCC rules, which are designed to provide reasonable protection  
against radio frequency interference. Operation of this equipment in other  
environments may cause interference with radio communications, in which  
case the user at his own expense will be required to take whatever measures  
may be required to correct this interference.  
Trademarks  
TI is a trademark of Texas Instruments Incorporated.  
iii  
 
iv  
 
Contents  
1
2
General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1  
1.1  
1.2  
1.3  
1.4  
1.5  
1.6  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2  
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2  
THS3001 EVM Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5  
Using The THS3001 EVM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6  
THS3001 EVM Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7  
General High-Speed Amplifier Design Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8  
Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1  
2.1  
2.2  
2.3  
2.4  
THS3001 High-Speed Operational Amplifier EVM Parts List . . . . . . . . . . . . . . . . . . . . . . 2-2  
THS3001 EVM Board Layouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2  
THS3001 Rev. A High-Speed Operational Amplifier EVM Parts List . . . . . . . . . . . . . . . 2-4  
THS3001 Rev. A. EVM Board Layouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4  
Figures  
1–1  
1–2  
1–3  
1–4  
1–5  
1–6  
2–1  
2–2  
2–3  
2–4  
2–5  
2–6  
THS3001 Evaluation Module – Original Version . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2  
THS3001 Rev. A Evaluation Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3  
THS3001 EVM Schematic – Original Version . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3  
THS3001 Rev. A EVM Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4  
THS3001 EVM Frequency Response with Gain = 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7  
THS3001 EVM Frequency Response with Inverting Gain = 1 . . . . . . . . . . . . . . . . . . . . . . . 1-7  
THS3001 EVM Component Placement Silkscreen and Solder Pads . . . . . . . . . . . . . . . . . 2-2  
THS3001 EVM PC Board Layout – Component Side . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3  
THS3001 EVM PC Board Layout – Back Side . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3  
THS3001 Rev. A EVM Component Placement Silkscreen and Solder Pads . . . . . . . . . . . 2-4  
THS3001 Rev. A EVM PC Board Layout – Component Side . . . . . . . . . . . . . . . . . . . . . . . . 2-5  
THS3001 Rev. A EVM PC Board Layout – Back Side . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5  
Tables  
2–1  
2–2  
THS3001 EVM Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2  
THS3001 Rev. A EVM Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4  
v
 
vi  
 
Chapter 1  
General Information  
This chapter details the Texas Instruments (TI ) THS3001 high-speed  
operational amplifier evaluation module (EVM), SLOP130. It includes a list of  
EVM features, a brief description of the module illustrated with a pictorial and  
a schematic diagram, EVM specifications, details on connecting and using the  
EVM, and a discussion on high-speed amplifier design considerations.  
Topic  
Page  
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2  
1.2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2  
1.3 THS3001 EVM Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–5  
1.4 Using The THS3001 EVM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–6  
1.5 THS3001 EVM Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–7  
1.6 General High-Speed Amplifier Design Considerations . . . . . . . . . . . 1–8  
1-1  
 
Features  
1.1 Features  
THS3001 operational amplifier EVM features include:  
High Bandwidth — 340 MHz, 3 dB at ±15 V  
±5-V to ±15-V Operation  
& Gain = 2  
CC  
Inverting and Noninverting Single-Ended Inputs  
Module Gain Set to +2 (Noninverting) and –1 (Inverting) — Adjustable  
Through Component Change.  
Nominal 50-Impedance Inputs and Outputs  
Standard SMA Miniature RF Connectors  
Good Example of High-Speed Amplifier Design and Layout  
1.2 Description  
The TI THS3001 high-speed current-feedback operational amplifier  
evaluation module (EVM) is a complete high-speed amplifier circuit. It consists  
of the TI THS3001 high-speed current-feedback operational amplifier IC,  
along with a small number of passive parts, mounted on a small circuit board  
measuring approximately 1.7 inch by 1.4 inch. The EVM uses standard SMA  
miniature RF connectors for inputs and outputs and is completely assembled,  
fully tested, and ready to use — just connect it to power, a signal source, and  
a load (if desired).  
Two versions of the THS3001 EVM are available. The original appears in  
Figure 1–1 and the Rev. A version appears in Figure 1–2.  
Figure 1–1. THS3001 Evaluation Module – Original Version  
–VCC  
+VCC  
GND  
J3  
C3  
–IN  
+
+
C1  
R5  
GND  
R1  
C4  
INVERTING  
C2  
U1  
J2  
R4  
NONINVERTING  
R2  
R3  
+IN  
GND  
J1  
LITERATURE NO  
SLOP 130  
009957  
THS3001 EVM  
1-2  
General Information  
 
Description  
Figure 1–2. THS3001 Rev. A Evaluation Module  
J1  
–VCC  
+VCC  
C2  
J2  
C1  
GND  
+
–IN  
+
GND  
TEXAS  
INSTRUMENTS  
R2  
INVERTING  
Rev. A  
J4  
R4  
C3  
NONINVERTING  
R1  
R3  
+IN  
GND  
R5  
U1  
C4  
J3  
SLOP130 Rev A  
THS3001 EVM Board  
The THS3001 EVM is equipped with both noninverting and inverting inputs.  
The noninverting input is set for a gain of 2 and the inverting input is set for a  
gain of 1. Each input is terminated with a 50-resistor to provide correct line  
impedance matching (Figure 1–3 for original version and Figure 1–4 for Rev.  
A). The amplifier IC output is routed through a 50-resistor both to provide  
correct line impedance matching and to help isolate capacitive loading on the  
output of the amplifier. Capacitive loading directly on the output of the IC  
decreases the amplifier’s phase margin and can result in peaking or  
oscillations.  
Figure 1–3. THS3001 EVM Schematic – Original Version  
V
CC  
C2  
+
0.1 µF  
C1  
R1  
6.8 µF/35 V  
1 kΩ  
J1  
J3  
Non-  
Inverting  
Input  
7
3
+
J2  
R2  
R3  
49.9 Ω  
6
U1  
Output  
THS3001  
49.9 Ω  
2
4
R5  
1 kΩ  
Inverting  
Input  
C3  
6.8 µF/35 V  
R4  
C4  
0.1 µF  
+
49.9 Ω  
–V  
CC  
1-3  
General Information  
 
Description  
Figure 1–4. THS3001 Rev. A EVM Schematic  
V
CC  
C2  
6.8 µF  
J1  
1
–V  
–V  
CC  
+
CC  
2
3
GND  
C3  
0.1 µF  
V
V
CC  
CC  
R2  
R4  
J2  
1 k1 kΩ  
–IN  
Inverting  
R1  
49.9 Ω  
7
2
R5  
49.9 Ω  
J4  
6
U1  
THS3001  
Rev. A  
Out  
J3  
3
+IN  
Noninverting  
+
4
C4  
0.1 µF  
R3  
49.9 Ω  
C1  
6.8 µF  
+
–V  
CC  
Even though the THS3001 is a current-feedback amplifier, the gain of the EVM  
can easily be changed to support a particular application by simply changing  
the ratio of resistors R1, R4, and R5 (R1, R2, and R4 for Rev. A) as described  
in the following equations:  
RF  
RG  
R1  
R5  
R4  
R2  
Inverting Gain  
(Rev. A)  
RF  
RG  
R1  
R4 R5  
R4  
R2 R1  
Noninverting Gain  
1
1
1
(Rev. A)  
In addition, some applications, such as those for video, may require the use  
of 75-cable and 75-EVM input termination and output isolation resistors.  
Any of the resistors on the EVM board can be replaced with a resistor of a  
different value; however, care must be taken because the surface-mount  
solder pads on the board are somewhat fragile and will not survive many  
desoldering/soldering operations.  
Because of the current feedback architecture, extra care must be taken to  
ensure that a feedback resistor is always included in the design. In addition,  
there must never be a capacitor directly in the feedback path between the  
amplifier output and the noninverting input. Disregarding this guideline will  
likely result in a part that oscillates.  
1-4  
General Information  
 
THS3001 EVM Specifications  
Note: External factors can significantly affect the overall gain of the EVM. For  
example, connecting test equipment with 50-input impedance to the EVM  
output will divide the output signal level by a factor of 2 (assuming the output  
isolation resistor on the EVM board remains 50 ). Similar effects can occur  
at the input, depending upon how the input signal sources are configured. The  
gain equations given above assume no signal loss in either the input or the  
output.  
The EVM circuit board is an excellent example of proper board layout for  
high-speed amplifier designs and can be used as a guide for user application  
board layouts.  
1.3 THS3001 EVM Specifications  
Supply voltage range, ±V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±5 V to ±15 V  
CC  
Supply current, I  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.5 mA Typ  
CC  
Input voltage, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±VCC, Max  
I
Output drive, I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA, Typ  
O
Continuous power dissipation at T = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 740 mW  
A
For complete THS3001 amplifier IC specifications and parameter  
measurement information, and additional application information, see the  
THS3001 data sheet, TI Literature Number SLOS217.  
1-5  
General Information  
 
Using The THS3001 EVM  
1.4 Using The THS3001 EVM  
The THS3001 EVM operates from power-supply voltages ranging from ±5 V  
to ±15 V. As shipped, the inverting input gain of the module is set to 1, the  
noninverting input gain is set to 2, and signal inputs on the module are  
terminated for 50-nominal impedance cables. An oscilloscope is typically  
used to view and analyze the EVM output signal.  
1.4.1 Steps for THS3001 EVM  
1) Ensure that all power supplies are set toOFF before making power supply  
connections to the THS3001 EVM.  
2) Select the operating voltage for the EVM and connect appropriate split  
power supplies to the pads on the module marked –VCC and +VCC.  
3) Connect the power supply ground to the module pad marked GND.  
4) Connect an oscilloscope to the module SMA output connector (J2)  
through a 50-nominal impedance cable (an oscilloscope having a 50-Ω  
input termination is preferred for examining very high frequency signals).  
5) Set the power supply to ON.  
6) Connect the signal input to either the noninverting input (J1) for a gain of  
2, or to the inverting input (J3) for a gain of 1.  
1.4.2 Steps for THS3001 Rev. A EVM  
1) Ensure that all power supplies are set toOFF before making power supply  
connections to the THS3001 EVM.  
2) Select the operating voltage for the EVM and connect appropriate split  
power supplies to J1 terminals on the module marked –VCC and +VCC.  
3) Connect the power supply ground to J1 terminal marked GND.  
4) Connect an oscilloscope to the module SMA output connector (J4)  
through a 50-nominal impedance cable (an oscilloscope having a 50-Ω  
input termination is preferred for examining very high frequency signals).  
5) Set the power supply to ON.  
6) Connect the signal input to either the noninverting input (J3) for a gain of  
2, or to the inverting input (J2) for a gain of 1.  
Note that each input connector is terminated with a 50-resistor to ground.  
With a 50-source impedance, the voltage seen by the THS3001 amplifier  
IC on the module will be the source signal voltage applied to the EVM.  
7) Verify the output signal on the oscilloscope.  
Note: The signal shown on an oscilloscope with a 50-input impedance will  
be the actual THS3001 amplifier IC output voltage. This is due to the voltage  
division between the output resistor (R2) and the oscilloscope input  
impedance.  
1-6  
General Information  
 
THS3001 EVM Performance  
1.5 THS3001 EVM Performance  
Figure 1–5 shows the typical frequency response of the THS3001 EVM using  
the noninverting input (G = 2). Typical values show a 3-dB bandwidth of  
340 MHz with a ±15-V power supply and 260 MHz with a ±5-V power supply.  
They also show a 0.1-dB frequency response of 17 MHz with a ±15-V power  
supply and 20 MHz with a ±5-V power supply.  
Figure 1–5. THS3001 EVM Frequency Response with Gain = 2  
7
6
V
CC  
= ±15 V  
5
4
3
V
CC  
= ±5 V  
2
1
0
–1  
–2  
–3  
V = 200 mV RMS  
I
R
= 150 Ω  
load  
100K  
1M  
10M  
f – Frequency – Hz  
100M  
1G  
Figure 1–6 shows the typical frequency response of the THS3001 EVM using  
the inverting input (G = 1). Typical 0.1 dB bandwidths are 15 MHz with a  
±15-V power supply and 17 MHz with a ±5-V power supply. Typical 3-dB  
bandwidths are 220 MHz at ±15-V and 210 MHz at ±5-V.  
Figure 1–6. THS3001 EVM Frequency Response with Inverting Gain = 1  
1
0
V
CC  
= ±15 V  
–1  
–2  
–3  
–4  
–5  
V
CC  
= ±5 V  
–6  
–7  
–8  
–9  
V = 200 mV RMS  
I
R
= 150 Ω  
load  
100K  
1M  
10M  
f – Frequency – Hz  
100M  
1G  
1-7  
General Information  
 
General High-Speed Amplifier Design Considerations  
1.6 General High-Speed Amplifier Design Considerations  
The THS3001 EVM layout has been designed and optimized for use with  
high-speed signals and can be used as an example when designing THS3001  
applications. Careful attention has been given to component selection,  
grounding, powersupplybypassing, andsignalpathlayout. Disregardofthese  
basic design considerations could result in less than optimum performance of  
the THS3001 high-speed, current-feedback video operational amplifier.  
Surface-mount components were selected because of the extremely low lead  
inductance associated with this technology. Also, because surface-mount  
components are physically small, the layout can be very compact. This helps  
minimize both stray inductance and capacitance.  
Tantalum power supply bypass capacitors (C1 and C3 for original and C1 and  
C2 for Rev. A) at the power input pads help supply currents for rapid, large  
signal changes at the amplifier output. The 0.1 µF power supply bypass  
capacitors (C2 and C4 for original version and C3 and C4 for Rev. A) were  
placed as close as possible to the IC power input pins in order to keep the PCB  
trace inductance to a minimum. This improves high-frequency bypassing and  
reduces harmonic distortion.  
A proper ground plane on both sides of the PCB should always be used with  
high-speed circuit design. This provides low-inductive ground connections for  
return current paths. In the area of the amplifier IC input pins, however, the  
ground plane was removed to minimize stray capacitance and reduce ground  
plane noise coupling into these pins. This is especially important for the  
invertingpinwhiletheamplifierisoperatinginthenoninvertingmode. Because  
the voltage at this pin swings directly with the noninverting input voltage, any  
stray capacitance would allow currents to flow into the ground plane, causing  
possible gain error and/or oscillation. Capacitance variations at the amplifier  
IC inverting input pin of less than 1 pF can significantly affect the response of  
the amplifier.  
In general, it is always best to keep signal lines as short and as straight as  
possible. Sharp 90 corners should be avoided — round corners or a series  
of 45 bends should be used, instead. Stripline techniques should also be  
incorporated when signal lines are greater than three inches in length. These  
traces should be designed with a characteristic impedance of either 50 or  
75 , as required by the application. Such signal lines should also be properly  
terminated with an appropriate resistor.  
Finally, proper termination of all inputs and outputs should be incorporated into  
the layout. Unterminated lines, such as coaxial cable, can appear to be a  
reactive load to the amplifier IC. By terminating a transmission line with its  
characteristic impedance, the amplifier’s load then appears to be purely  
resistive and reflections are absorbed at each end of the line. Another  
advantage of using an output termination resistor is that capacitive loads are  
isolated from the amplifier output. This isolation helps minimize the reduction  
in amplifier phase-margin and improves the amplifier stability for improved  
performance such as reduced peaking and settling times.  
1-8  
General Information  
 
Chapter 2  
Reference  
This chapter includes a parts list and PCB layout illustrations for the THS3001  
EVM and the THS3001 Rev. A EVM.  
Topic  
Page  
2.1 THS3001 High-Speed Operational Amplifier EVM Parts List . . . . . . . 2–2  
2.2 THS3001 EVM Board Layouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–2  
2.3 THS3001 Rev. A High-Speed Operational Amplifier EVM Parts List 2–4  
2.4 THS3001 Rev. A EVM Board Layouts . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–4  
2-1  
 
THS3001 High-Speed Current-Feedback Video Operational Amplifier EVM Parts List  
2.1 THS3001 High-Speed Current-Feedback Video Operational Amplifier  
EVM Parts List  
Table 2–1.THS3001 EVM Parts List  
Manufacturer/Digi-Key  
Reference  
Description  
Size  
Part Number  
C1, C3  
Capacitor, 6.8 µF, 35 V, SM  
D
Sprague 293D685X9035D2T  
C2, C4  
Capacitor, 0.1 µF, ceramic, 10%, SM  
1206 Sprague 11C1201E104M5NT  
Amphenol ARF1205–ND  
J1, J2, J3  
Connector, SMA 50-vertical PC mount, through-  
hole  
R2, R3, R4 Resistor, 49.9 Ω, 1%, 1/10 W, SM  
1206 Digi-Key P49.9CTR–ND  
1206 Digi-Key P1.0KCTR–ND  
SOIC-8 TI THS3001  
R1, R5  
U1  
Resistor, 1 kΩ, 1%, 1/10 W, SM  
IC, THS3001, operational amplifier  
PCB, THS3001 EVM  
PCB1  
2.2 THS3001 EVM Board Layouts  
Board layout examples of the THS3001 EVM PCB are shown in the following  
illustrations. They are not to scale and appear here only as a reference.  
Figure 2–1. THS3001 EVM Component Placement Silkscreen and Solder Pads  
–VCC  
J3  
+VCC  
GND  
C3  
–IN  
R5  
U1  
C1  
C2  
GND  
R1  
C4  
INVERTING  
J2  
NONINVERTING  
R4  
R3  
R2  
+IN  
GND  
LITERATURE NO.  
SLOP 130  
–3  
009957  
J1  
THS3001 EVM  
2-2  
Reference  
 
THS3001 EVM Board Layouts  
Figure 2–2. THS3001 EVM PC Board Layout – Component Side  
Figure 2–3. THS3001 EVM PC Board Layout – Back Side  
2-3  
Reference  
 
THS3001 Rev. A High-Speed Operational Amplifier EVM Parts List  
2.3 THS3001 Rev. A High-Speed Operational Amplifier EVM Parts List  
Table 2–2.THS3001 Rev. A EVM Parts List  
Manufacturer/Digi-Key  
Reference  
Description  
Size  
Part Number  
C1, C2  
C3, C4  
J1  
Capacitor, 6.8 µF, 35 V, SM  
Capacitor, 0.1 µF, ceramic, 10%, SM 1206 Sprague 11C1201E104M5NT  
D
Sprague 293D685X9035D2T  
Terminal Block  
Digi-Key ED1515–ND  
J2, J3, J4  
Connector, SMA 50-vertical PC  
mount, through-hole  
Amphenol ARF1205–ND  
R1, R3, R5 Resistor, 49.9 Ω, 1%, 1/8 W, SM  
1206 Digi-Key P49.9CTR–ND  
1206 Digi-Key P1.0KCTR–ND  
SOIC-8 TI THS3001  
R2, R4  
U1  
Resistor, 1 kΩ, 1%, 1/8 W, SM  
IC, THS3001, operational amplifier  
PCB, THS3001 Rev. A EVM  
PCB1  
2.4 THS3001 Rev. A EVM Board Layouts  
Board layout examples of the THS3001 Rev. A EVM PCB are shown in the  
following illustrations. They are not to scale and appear here only as a  
reference.  
Figure 2–4. THS3001 Rev. A EVM Component Placement Silkscreen and Solder Pads  
J1  
–VCC  
C1  
+VCC  
C2  
J2  
GND  
+
–IN  
+
GND  
TEXAS  
INSTRUMENTS  
R2  
INVERTING  
J4  
R4  
C3  
Rev. A  
NONINVERTING  
R1  
R3  
+IN  
GND  
R5  
U1  
C4  
J3  
SLOP130 Rev A  
THS3001 EVM Board  
2-4  
Reference  
 
THS3001 Rev. A EVM Board Layouts  
Figure 2–5. THS3001 Rev. A EVM PC Board Layout – Component Side  
Rev. A  
Figure 2–6. THS3001 Rev. A EVM PC Board Layout – Back Side  
Rev. A  
2-5  
Reference  
 
2-6  
Reference  
 

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